DHL Supply Chain has begun construction of a dedicated semiconductor logistics facility in Chitose, Hokkaido, Japan following a groundbreaking ceremony last month.
The project is intended to support Japan’s push to strengthen domestic chip manufacturing and stimulate the regional economy, while advancing DHL Supply Chain’s global plan to double its business by 2030.
Located next to Chitose’s next-generation semiconductor industrial cluster, the single-storey, multi-user site will provide inventory storage, in-plant logistics and on-demand delivery of engineering parts for semiconductor equipment makers and material suppliers.
DHL said the location offers strong connectivity, sitting close to the New Chitose Airport Interchange, six minutes from New Chitose Airport and around 20 minutes from key research, development and manufacturing facilities.
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“The Chitose Logistics Center will serve as a hub, contributing to the growth of Hokkaido’s semiconductor ecosystem and the revitalisation of the local economy,” said Jerome Gillet, president and representative director, CEO Japan and Korea, DHL Supply Chain.
“By drawing on DHL’s global network and advanced logistics technology, we will support the semiconductor industry through precise quality control, timely delivery of precision parts and responsiveness to the field’s needs.
“DHL Supply Chain remains committed to providing sustainable supply chains that balance reliability and environmental responsibilities.”
The facility will have a total floor area of about 14,500m² (156,000ft²) and is designed for flexible, high-functioning operations to meet advanced semiconductor logistics requirements.
Planned sustainability measures include the use of renewable energy in the building and operations, rainwater harvesting to optimise water use and LED lighting with motion sensors to improve energy efficiency.
Completion is scheduled by the end of 2026.
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